Product-family view · exact unit photos before orderGIGABYTE
GIGABYTE G262-ZO0-4XMI250-NEW — Gigabyte G262-Zo0 Rack 2.5 Inch SFF 4 Bay Hybrid HSHD HSPS X4 MI250 Oam GPU Pre Configuration 2U Server Chassis ( G262ZO0 ) - ( 3 ) Three PCIE GEN4 M.2 ( 1 Onboard 2 Via CMTP072 ) + Small Form Factor 4B / 4SFF NVME / SATA / SAS Hot Swap Hard Drive Hot Swap Power Supply
Request a quotation for GIGABYTE G262-ZO0-4XMI250-NEW — Gigabyte G262-Zo0 Rack 2.5 Inch SFF 4 Bay Hybrid HSHD HSPS X4 MI250 Oam GPU Pre Configuration 2U Server Chassis ( G262ZO0 ) - ( 3 ) Three PCIE GEN4 M.2 ( 1 Onboard 2 Via CMTP072 ) + Small Form Factor 4B / 4SFF NVME / SATA / SAS Hot Swap Hard Drive Hot Swap Power Supply. ASTER RACKIT will confirm configuration, condition, quantity, availability, packing and delivery.
Product & supply gallery
Model view, QC, warehouse and export preparation.
Model-specific imagery is identified as such. Context images show the relevant product family, inspection workflow or packing environment and are not presented as exact-unit proof.
Product-family view · exact unit photos before order
PHOTOGRAPHS THAT SUPPORT YOUR RFQ
Match the part number and physical interface.
Attach a photo brief to the request for GIGABYTE G262-ZO0-4XMI250-NEW — Gigabyte G262-Zo0 Rack 2.5 Inch SFF 4 Bay Hybrid HSHD HSPS X4 MI250 Oam GPU Pre Configuration 2U Server Chassis ( G262ZO0 ) - ( 3 ) Three PCIE GEN4 M.2 ( 1 Onboard 2 Via CMTP072 ) + Small Form Factor 4B / 4SFF NVME / SATA / SAS Hot Swap Hard Drive Hot Swap Power Supply. This is a checklist to agree, not a record that inspection has already been performed.
Label and connector views
Ask for manufacturer and OEM part numbers, front/back views and the connector or edge contacts. Capacity, interface, form factor and intended host must match the requested component.
Lot and condition
Record quantity, condition, firmware or hardware revision where relevant, plus representative and exception photographs. Avoid relying on one generic image for a mixed lot.
Protect the shipment
Request individual separation, antistatic protection and connector protection as appropriate. Show the components in trays or packing, without inventing a component-specific boot screen.
Technical identity
Verified catalog facts before CTO validation.
We publish only the identity fields already present in the catalog. Exact CPU, DIMM, port, bay, license and firmware details are confirmed against the requested configuration before quotation.
BrandGIGABYTE
Model / MPNG262-ZO0-4XMI250-NEW
Product familyAI & GPU Servers
Platform classServer
Form factor / physical class2U chassis
Supply conditionFactory new
AvailabilityContact us for availability
Configuration statusExact option set, compatibility and included accessories confirmed with quotation
Product detail
What to confirm before you buy.
Confirm quantity, accessories, licenses, packing and delivery with our team before placing an order.
GIGABYTE G262-ZO0-4XMI250-NEW — Gigabyte G262-Zo0 Rack 2.5 Inch SFF 4 Bay Hybrid HSHD HSPS X4 MI250 Oam GPU Pre Configuration 2U Server Chassis ( G262ZO0 ) - ( 3 ) Three PCIE GEN4 M.2 ( 1 Onboard 2 Via CMTP072 ) + Small Form Factor 4B / 4SFF NVME / SATA / SAS Hot Swap Hard Drive Hot Swap Power Supply is a server model option for international B2B buyers comparing factory-new and pre-owned infrastructure. Use the model name and part number to begin an exact configuration, quantity and condition review.
ASTER RACKIT reviews the platform by chassis generation, CPU family, memory population, drive bay layout, RAID or HBA requirement, GPU and PCIe expansion, network speed, power supply configuration, rails, bezels and destination packing. Buyers can request a single unit, a repeat purchase program or a mixed-model project list.
The final quotation confirms availability, condition, accessories, optional components, packaging, lead time and delivery path. This makes the G262-ZO0-4XMI250-NEW option easier to compare across budget expansion, data-center refresh, lab capacity, AI, storage and virtualization projects.
Select the processor level that fits your workload, budget and delivery schedule.
Choose ECC memory capacity for virtualization, database, AI or general compute use.
Plan SSD, NVMe or high-capacity HDD options with required bay layout and carriers.
Add NICs, optics, rails, bezels, power accessories and export packing for your destination.
Compatibility and accessories
Brand-specific and universal options, separated clearly.
International buyers often lose time on small mismatches. ASTER RACKIT reviews the details before preparing the offer.
Dell PERC/iDRAC, HPE Smart Array/iLO, Lenovo XClarity parts, Cisco UCS VIC/FI options and Supermicro riser/backplane kits are separated by brand and generation.
Intel/AMD CPUs, ECC DIMMs, SAS/SATA/NVMe drives, PCIe NICs, GPUs, optics and power cords are planned around open standards where the server platform supports them.
We check CPU support, DIMM population, drive bay layout, RAID/HBA mode, GPU riser power, NIC speed, rails, bezel, PSU and export packing before quote.
ASTER RACKIT service
What we prepare before shipment.
Brand, model and chassis generationFront-bay layout and drive carriersProcessor, memory and storage optionsCondition note for the final offerPower supplies, rails and accessoriesExport packing, lead time and freight route
Important purchasing note
Use this model listing to begin your request. The formal offer confirms the available unit, selected options, condition, accessories, warranty, packing and delivery date.
AI infrastructure buying guide
Plan compute, network, storage, power and cooling as one AI system.
An 8-GPU server is only one part of the project. We connect GPU generation, host CPU and memory, high-speed NIC/HCA layout, 200G/400G/800G fabric, storage throughput, optics, power, cooling and expansion into one purchasing path.
AI training teams
Scale-out H100, H200, B200 and B300 projects where east-west bandwidth and validated fabric design matter.
Enterprise inference operators
Compact clusters using L40S, RTX PRO 6000 and similar accelerators for private AI services.
Cloud, HPC and research buyers
Teams comparing Ethernet/RoCE and InfiniBand architectures across multiple rack and budget stages.
Before we quote
The information that turns a request into the right offer.
You can start with partial information. These are the decisions our team closes with you before order confirmation.
DecisionWhat we reviewWhat you receive
GPU node planServer model, GPU type/count, CPU, memory and GPU/NIC localityA node-by-node configuration schedule
Fabric designEthernet/RoCE or InfiniBand, NIC/HCA count, blocking target and failure stateTopology, port map and switch shortlist
Storage pathTraining data size, protocol, throughput, metadata and checkpoint behaviorSeparate storage and compute-fabric requirements
Facility fitRack depth, total weight, voltage, PDU, power, cooling and cable routesRack, power and thermal notes before shipment
Inside the supply process
Product, configuration and delivery shown in context.
What appears on the offer
Commercial detail buyers can approve with confidence.
Claims are tied to the exact model, serial status, configuration and destination shown on the quotation.
The offer separates the main unit, selected options, required accessories and any software or subscription items.
Condition, included rails, bezels, caddies, cables, documentation and packaging are stated before order confirmation.
Selected parts are checked against current manufacturer documentation and available configuration tools.
Validation, allocation, testing, packing, export clearance and transit are shown as separate milestones.
Provider, duration, service level, covered geography and material exclusions appear on the quote.
The offer or sales contract states the DOA notice window, written RMA process, return-freight responsibility, inspection or restocking charges, non-returnable configured or licensed items, remedy and return location.
The named destination, packed size, freight method and quoted Incoterms® 2020 rule are recorded clearly.
Project path
From requirement to international delivery.
Tell us what must work
Send the model, workload, quantity, preferred condition, deadline and destination.
Review the technical fit
We close configuration, compatibility, licensing, power, accessories and acceptable alternatives.
Approve the documented offer
You review availability, condition, inclusions, warranty, timeline, packing and freight terms.
Prepare, pack and hand over
Testing or seal review, photos, protective packing, export documents and carrier handover follow the approved scope.
Buyer questions
Answers before the first purchase order.
Should an H100 or H200 cluster start at 400G?
Often, but not automatically. The correct speed depends on node interfaces, workload traffic, storage design, rack count, blocking target and future scale.
When does 800G make sense?
It is useful for newer high-density nodes, high-radix spine layers, dual-400G breakouts and designs intended to reduce fabric tiers.
Do you quote optics and cables with the switches?
Yes. A complete project can include NIC/HCA, optics, DAC/AOC, fiber trunks, patching direction, cable length and spare quantities.
Can you guarantee non-blocking performance?
Only after the node interfaces, topology, cable plan, failure behavior and workload have been calculated. We do not make a blanket performance claim from switch speed alone.
What information speeds up an AI quote?
Send GPU/server type, current and target node count, workload, NIC/HCA layout, preferred fabric, storage throughput, rack power and delivery location.
BEFORE APPROVING YOUR BOM
Turn the product listing into an acceptance brief.
Request the offered unit’s identifiers, configuration, condition, test scope and packing evidence. The catalog is only the starting point.
