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EXACT IDENTIFIERS · CONNECTED TOOLS

Search the complete hardware catalog

Compare the fields actually recorded, preserve complete part-number suffixes and carry your choices into a local RFQ.

7,220 matching results

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Model or full PNManufacturerCategoryEvidence depthInterfaceCapacityGenerationLifecycleSortClear all filters

Facet values may be title-derived and unverified. Missing lifecycle status remains unverified. Filter values match exactly.

category: memory

HPEpart number

HPE 398707-051 — Server memory

component density: 2GB
product bus type: PC2-5300F
component speed: DDR2-667

Source-listed identity · parameters unverified

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HPEpart number

HPE 500209-562 — Server memory

component density: 2GB
product bus type: PC3-10600E
component speed: DDR3-1333

Source-listed identity · parameters unverified

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HPEpart number

HPE 500209-061 — Server memory

component density: 2GB
product bus type: PC3-10600E
component speed: DDR3-1333

Source-listed identity · parameters unverified

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Nanyapart number

NT2GC72B8PA0NF-CG

Nanya NT2GC72B8PA0NF-CG — Server memory

component density: 2GB
product bus type: PC3-10600E
component speed: DDR3-1333

Source-listed identity · parameters unverified

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HPEpart number

HPE 591750-171 — Server memory

component density: 4GB
product bus type: PC3-10600R
component speed: DDR3-1333

Source-listed identity · parameters unverified

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Micronpart number

MT36JSZF51272PZ-1G4F1DD

Micron MT36JSZF51272PZ-1G4F1DD — Server memory

component density: 4GB
product bus type: PC3-10600R
component speed: DDR3-1333

Source-listed identity · parameters unverified

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SK hynixpart number

HMT325U7BFR8A-H9

SK hynix HMT325U7BFR8A-H9 — Server memory

component density: 2GB
product bus type: PC3L-10600E
component speed: DDR3-1333

Source-listed identity · parameters unverified

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Samsungpart number

M391B5273CH0-CH9

Samsung M391B5273CH0-CH9 — Server memory

component density: 4GB
product bus type: PC3-10600E
component speed: DDR3-1333

Source-listed identity · parameters unverified

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SK hynixpart number

HMT351U7BFR8C-H9

SK hynix HMT351U7BFR8C-H9 — Server memory

component density: 4GB
product bus type: PC3-10600E
component speed: DDR3-1333

Source-listed identity · parameters unverified

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Dellpart number

NHN647R26415F-D64NSF

Dell NHN647R26415F-D64NSF — Server memory

Technical fields: Pending source review

Source-listed identity · parameters unverified

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SK hynixpart number

HMT325U7BFR8C-H9

SK hynix HMT325U7BFR8C-H9 — Server memory

component density: 2GB
product bus type: PC3-10600E
component speed: DDR3-1333

Source-listed identity · parameters unverified

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Micronpart number

MT36JSZF1G72PZ-1G4D1DD

Micron MT36JSZF1G72PZ-1G4D1DD — Server memory

component density: 8GB ( 1X8GB )
product bus type: PC3-10600R
component speed: DDR3-1333

Source-listed identity · parameters unverified

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Samsungpart number

M395T5160CZ4-CE65

Samsung M395T5160CZ4-CE65 — Server memory

component density: 4GB
product bus type: PC2-5300F
component speed: DDR2-667

Source-listed identity · parameters unverified

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Samsungpart number

M391B2873EH1-CF8

Samsung M391B2873EH1-CF8 — Server memory

component density: 1GB
product bus type: PC3-8500E
component speed: DDR3-1066

Source-listed identity · parameters unverified

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Samsungpart number

M391B5673EH1-CH9

Samsung M391B5673EH1-CH9 — Server memory

component density: 2GB
product bus type: PC3-10600E
component speed: DDR3-1333

Source-listed identity · parameters unverified

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Samsungpart number

M321R2GA3EB2-CWM

Samsung M321R2GA3EB2-CWM — Server memory

capacity: 16 GB
memory type: DDR5
module signal type: ECC RDIMM

Source-listed identity · parameters unverified

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Samsungpart number

M324R2GA3DB0-CWMOD

Samsung M324R2GA3DB0-CWMOD — Server memory

capacity: 16 GB
memory type: DDR5
module signal type: ECC UDIMM

Source-listed identity · parameters unverified

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Samsungpart number

M324R2GA3DB0-CWMLS

Samsung M324R2GA3DB0-CWMLS — Server memory

capacity: 16 GB
memory type: DDR5
module signal type: ECC UDIMM

Source-listed identity · parameters unverified

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Samsungpart number

M393A2K43DB3-CWESM

Samsung M393A2K43DB3-CWESM — Server memory

capacity: 16 GB
memory type: DDR4
module signal type: ECC RDIMM

Source-listed identity · parameters unverified

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Samsungpart number

M321R2GA3BB0-CQKMG

Samsung M321R2GA3BB0-CQKMG — Server memory

capacity: 16 GB
memory type: DDR5
module signal type: ECC RDIMM

Source-listed identity · parameters unverified

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Samsungpart number

M321R2GA3EB2-CWMJJ

Samsung M321R2GA3EB2-CWMJJ — Server memory

capacity: 16 GB
memory type: DDR5
module signal type: ECC RDIMM

Source-listed identity · parameters unverified

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Kingstonpart number

Kingston KSM29RD8/16HCI — Server memory

capacity: 16 GB
memory type: DDR4
module signal type: Registered ECC DIMM

Source-listed identity · parameters unverified

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Samsungpart number

M321R6GA0BB0-CQK

Samsung M321R6GA0BB0-CQK — Server memory

Capacity: 48 GB
Memory type: DDR5
Rated memory speed: 4800 MT/s

Source-listed identity · parameters unverified

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Samsungpart number

M321R6GA3PB2-CCP

Samsung M321R6GA3PB2-CCP — Server memory

Capacity: 48 GB
Memory type: DDR5
Rated memory speed: 6400 MT/s

Source-listed identity · parameters unverified

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01

Server platforms — the next decisions

Server platforms

Server platforms

Specify rack height, bay size and backplane options.

This guide adds the decisions, documents and next steps that support this page.

Server directory

Server platforms illustrative environment

02

Choose the right route

Rack systems

Plan rack depth, rail kit and airflow before choosing a chassis.

Server directory

Blade systems

Identify the enclosure, fabric modules and generation-specific interconnects.

Server configurator

Multi-node systems

Separate shared power, node count and service access in the request.

03

Details that change the configuration

Chassis & drive layout

Specify rack height, bay size and backplane options.

Processor & memory

Record CPU generation, socket count and DIMM population.

Power & management

Include input power, PSU redundancy and remote-management needs.

04

From requirement to handover

01
Define workload
02
Select chassis
03
Review configuration
04
Prepare acceptance

A planning sequence, not a record of completed work.

05

Explore the relevant catalog

All manufacturers

Recorded catalog identities

Counts show records in the site catalog. They do not represent stock, available quantities or verified compatibility.

Snapshot: 2026-11-03

Rack & blade servers3,403

06

Compare the buying requirements

Server platforms comparison brief
Decision	Record in your brief	Evidence to retain
Chassis & drive layout	Specify rack height, bay size and backplane options.	Complete identifier and source revision
Processor & memory	Record CPU generation, socket count and DIMM population.	Platform document or written clarification
Power & management	Include input power, PSU redundancy and remote-management needs.	Offered-unit details and agreed scope

Open the comparison workspace

07

Build your readiness checklist

Your preparation progress

Tick items as you prepare them. This is your personal checklist, not a hardware validation.

0 / 4 prepared0

Exact chassis model recordedCPU and DIMM plan attachedDrive backplane and risers identifiedRails and power requirements listed

Saved in this browser when local storage is available.

08

A closer look at the hardware

Server platforms illustrative working environment — Server platforms environment Explore

Illustrative configuration discussion — Review the requirement Explore

Illustrative protective packing workflow — Prepare the handover Explore

1 / 3

Reference-based generated scenes; actual-unit photos are available only through an explicit unit-specific request. Related models are separate catalog records, not substitutes for the item on this page.

09

Keep the supporting material together

Server directory

Continue the relevant directory or service flow.

Server configurator

Use the connected tool to develop the requirement.

Buying guides

Retain the supporting reference with your project brief.

10

Turn the brief into the next step

Server platforms

Keep the requirement specific.

Exact chassis model recorded · CPU and DIMM plan attached · Drive backplane and risers identified · Rails and power requirements listed.

Discuss this requirement Review quote basket