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EXACT IDENTIFIERS · CONNECTED TOOLS

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Compare the fields actually recorded, preserve complete part-number suffixes and carry your choices into a local RFQ.

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q: AMD

HPEmanufacturer part number

HP DL365 G10 PLUS 2.5

HPE HP DL365 G10 PLUS 2.5 — Chassis & node trays

processor support max number processor configuration: UP TO ( 2 ) TWO CPUs
processor socket type: SP3
processor compatibility: 3RD GEN AMD EPYC PROCESSORS ( MILAN-X / MILAN 7003 SERIES )

Source-listed identity · parameters unverified

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MITACmanufacturer part number

B8021G88V2HR-2T-N-RET

MITAC B8021G88V2HR-2T-N-RET — Chassis & node trays

configuration includes: ( 1 ) ONE 1U CHASSIS ( 1 ) ONE HEATSINK ( 2 ) TWO 1600W HOT SWAP POWER SUPPLIES ( 1 ) ONE RACK MOUNT RAIL KIT ASSEMBLY
processor support processor socket type: SP3
max number processor supported: UP TO ( 1 ) ONE CPU

Source-listed identity · parameters unverified

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MITACmanufacturer part number

B8021G88V2HR-2T-RM-N2-RET

MITAC B8021G88V2HR-2T-RM-N2-RET — Chassis & node trays

configuration includes: ( 1 ) ONE 1U CHASSIS ( 1 ) ONE HEATSINK ( 2 ) TWO 1600W HOT SWAP POWER SUPPLIES ( 1 ) ONE RACK MOUNT RAIL KIT ASSEMBLY
processor support processor socket type: SP3
max number processor supported: UP TO ( 1 ) ONE CPU

Source-listed identity · parameters unverified

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MITACmanufacturer part number

B8021G88V2HR-2T-RM-N2H-RET

MITAC B8021G88V2HR-2T-RM-N2H-RET — Chassis & node trays

configuration includes: ( 1 ) ONE 1U CHASSIS ( 1 ) ONE HEATSINK ( 2 ) TWO 1600W HOT SWAP POWER SUPPLIES ( 1 ) ONE RACK MOUNT RAIL KIT ASSEMBLY
processor support processor socket type: SP3
max number processor supported: UP TO ( 1 ) ONE CPU

Source-listed identity · parameters unverified

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AMDpart number

AMD 49Y7336-RETAIL — Processors

thermal design power: 115W
kit includes: ( 1 ) CPU ( 1 ) HEATSINK

Source-listed identity · parameters unverified

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AMDpart number

OS6282YETGGGU-D

AMD OS6282YETGGGU-D — Processors

thermal design power: 140W

Source-listed identity · parameters unverified

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AMDpart number

AMD 00AM130 — Processors

thermal design power: 115W
sockets supported: G34
kit includes: ( 1 ) ONE CPU ( 1 ) ONE HEATSINK

Source-listed identity · parameters unverified

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AMDpart number

AMD 00AM120 — Processors

thermal design power: 115W
sockets supported: G34
kit includes: ( 1 ) ONE CPU ( 1 ) ONE HEATSINK

Source-listed identity · parameters unverified

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AMDpart number

AMD 00AM110 — Processors

thermal design power: 115W
sockets supported: G34
kit includes: ( 1 ) ONE CPU ( 1 ) ONE HEATSINK

Source-listed identity · parameters unverified

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AMDpart number

AMD 00AM116 — Processors

thermal design power: 115W
sockets supported: G34
kit includes: ( 1 ) ONE CPU ( 1 ) ONE HEATSINK >

Source-listed identity · parameters unverified

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AMDpart number

OS6274WKTGGGU-RETAIL

AMD OS6274WKTGGGU-RETAIL — Processors

thermal design power: 115W
sockets supported: G34

Source-listed identity · parameters unverified

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AMDpart number

OS6174WKTCEGO-D

AMD OS6174WKTCEGO-D — Processors

thermal design power: 115W

Source-listed identity · parameters unverified

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AMDpart number

AMD OS2373NAP4DGI — Processors

Technical fields: Pending source review

Source-listed identity · parameters unverified

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AMDpart number

OS6172WKTCEGO-D

AMD OS6172WKTCEGO-D — Processors

thermal design power: 115W

Source-listed identity · parameters unverified

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AMDpart number

AMD OS6124VAT8EGO — Processors

thermal design power: 85W
sockets supported: G34

Source-listed identity · parameters unverified

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AMDpart number

AMD OSP280FAA6CB — Processors

Technical fields: Pending source review

Source-listed identity · parameters unverified

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AMDpart number

AMD OS6128WKT8EGO — Processors

multi-core: 8-CORE
voltage: 1.30V

Source-listed identity · parameters unverified

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AMDpart number

OS6128WKT8EGOWOF

AMD OS6128WKT8EGOWOF — Processors

multi-core: 8-CORE
voltage: 1.30V

Source-listed identity · parameters unverified

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AMDpart number

AMD OS6168WKTCEGO — Processors

thermal design power: 115W
sockets supported: G34

Source-listed identity · parameters unverified

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01

Server platforms — the next decisions

Server platforms

Server platforms

Specify rack height, bay size and backplane options.

This guide adds the decisions, documents and next steps that support this page.

Server directory

Server platforms illustrative environment

02

Choose the right route

Rack systems

Plan rack depth, rail kit and airflow before choosing a chassis.

Server directory

Blade systems

Identify the enclosure, fabric modules and generation-specific interconnects.

Server configurator

Multi-node systems

Separate shared power, node count and service access in the request.

03

Details that change the configuration

Chassis & drive layout

Specify rack height, bay size and backplane options.

Processor & memory

Record CPU generation, socket count and DIMM population.

Power & management

Include input power, PSU redundancy and remote-management needs.

04

From requirement to handover

01
Define workload
02
Select chassis
03
Review configuration
04
Prepare acceptance

A planning sequence, not a record of completed work.

05

Explore the relevant catalog

All manufacturers

Recorded catalog identities

Counts show records in the site catalog. They do not represent stock, available quantities or verified compatibility.

Snapshot: 2026-09-15

Rack & blade servers3,379

06

Compare the buying requirements

Server platforms comparison brief
Decision	Record in your brief	Evidence to retain
Chassis & drive layout	Specify rack height, bay size and backplane options.	Complete identifier and source revision
Processor & memory	Record CPU generation, socket count and DIMM population.	Platform document or written clarification
Power & management	Include input power, PSU redundancy and remote-management needs.	Offered-unit details and agreed scope

Open the comparison workspace

07

Build your readiness checklist

Your preparation progress

Tick items as you prepare them. This is your personal checklist, not a hardware validation.

0 / 4 prepared0

Exact chassis model recordedCPU and DIMM plan attachedDrive backplane and risers identifiedRails and power requirements listed

Saved in this browser when local storage is available.

08

A closer look at the hardware

Server platforms — Rack Server 2u Chassis facility reference — Rack Server 2u Chassis Explore

Server platforms — Server Internals Open facility reference — Server Internals Open Explore

Server platforms — Datacenter Cold Aisle facility reference — Datacenter Cold Aisle Explore

1 / 3

Reference-based generated scenes; actual-unit photos are available only through an explicit unit-specific request. Related models are separate catalog records, not substitutes for the item on this page.

09

Keep the supporting material together

Server directory

Continue the relevant directory or service flow.

Server configurator

Use the connected tool to develop the requirement.

Buying guides

Retain the supporting reference with your project brief.

10

Turn the brief into the next step

Server platforms

Keep the requirement specific.

Exact chassis model recorded · CPU and DIMM plan attached · Drive backplane and risers identified · Rails and power requirements listed.

Discuss this requirement Review quote basket