ASTER RACKIT — ITEM RFQ DRAFT
Not an offer, order, stock allocation or OEM-approved BOM.

Identifier: AMD EPYC™ 7552
Manufacturer: AMD
Record type: processor-model
URL: https://www.aster-rackit.com/explore/product/amd-amd-epyc-7552-0970ea2abe
Quantity: [enter]
Condition: [confirm]
Destination: [enter]

RECORDED TECHNICAL FIELDS — CHECK EVIDENCE STATUS
CPU cores: 48 [unverified_inherited]
Threads: 96 [unverified_inherited]
Base clock: 2.2 GHz [unverified_inherited]
Maximum boost clock: 3.3 GHz [unverified_inherited]
Default TDP: 200 W [unverified_inherited]
Processor platform: SP3 [unverified_inherited]
Supported socket configurations: 1P / 2P [unverified_inherited]
L3 cache: 192 MB [unverified_inherited]
Memory type: DDR4 [unverified_inherited]
Memory channels: 8 [unverified_inherited]
Memory specification: Up to 3200 MT/s [unverified_inherited]
PCI Express: PCIe® 4.0 x128 [unverified_inherited]
Title-derived · processor family: AMD EPYC [unverified_inherited]
Series: EPYC 7002 Series [oem_catalog_verified]
# of CPU Cores: 48 [oem_catalog_verified]
# of Threads: 96 [oem_catalog_verified]
Max. Boost Clock: Up to 3.3 GHz [oem_catalog_verified]
Base Clock: 2.2 GHz [oem_catalog_verified]
L3 Cache: 192 MB [oem_catalog_verified]
Default TDP: 200 [oem_catalog_verified]
Platform: SP3 [oem_catalog_verified]
Socket Count: 1P, 2P [oem_catalog_verified]
PCI Express Version: PCIe 4.0 x128 [oem_catalog_verified]
System Memory Type: DDR4 [oem_catalog_verified]
Memory Channels: 8 [oem_catalog_verified]
System Memory Specification: Up to 3200 [oem_catalog_verified]
Per Socket Mem BW: 204.8 [oem_catalog_verified]
Product ID Boxed: 100-100000076WOF [oem_catalog_verified]
Product ID Tray: 100-000000076 [oem_catalog_verified]
Supported Technologies: AMD Infinity Guard, AMD Infinity Architecture [oem_catalog_verified]
cpu series: 2ND GEN AMD EPYC FAMILY ( 7002 SERIES ) [reseller_asserted_unverified]
socket type: SP3 [reseller_asserted_unverified]
note: NO HEATSINK, NO ACCESSORIES OR TOOLS INCLUDED ADDITIONAL INFORMATION: THIS PROCESSOR IS NOT VENDOR LOCKED [reseller_asserted_unverified]
performance cpu frequency: 2.2GHZ [reseller_asserted_unverified]
cpu max turbo frequency: 3.3GHZ [reseller_asserted_unverified]
multi-core: 48-CORE [reseller_asserted_unverified]
threads: 96 [reseller_asserted_unverified]
cache: 192MB L3 [reseller_asserted_unverified]
thermal design power: 200W [reseller_asserted_unverified]
number of processors supported: 1P / 2P [reseller_asserted_unverified]
memory specs memory types: DDR4 [reseller_asserted_unverified]
max memory frequency: 3200 MHZ ( DDR4 ) [reseller_asserted_unverified]
max num. memory channels: 8 [reseller_asserted_unverified]
per socket memory bandwidth: 204.8GB/S [reseller_asserted_unverified]
expansion options pcie support: GEN4 X128 [reseller_asserted_unverified]
cpu series: 2ND GEN AMD EPYC FAMILY ( 7002 SERIES ) [reseller_asserted_unverified]
socket type: SP3 [reseller_asserted_unverified]
note: NO HEATSINK, NO ACCESSORIES OR TOOLS INCLUDED ADDITIONAL INFORMATION: THIS PROCESSOR IS NOT VENDOR LOCKED [reseller_asserted_unverified]
performance cpu frequency: 2.2GHZ [reseller_asserted_unverified]
cpu max turbo frequency: 3.3GHZ [reseller_asserted_unverified]
multi-core: 48-CORE [reseller_asserted_unverified]
threads: 96 [reseller_asserted_unverified]
cache: 192MB L3 [reseller_asserted_unverified]
thermal design power: 200W [reseller_asserted_unverified]
number of processors supported: 1P / 2P [reseller_asserted_unverified]
memory specs memory types: DDR4 [reseller_asserted_unverified]
max memory frequency: 3200 MHZ ( DDR4 ) [reseller_asserted_unverified]
max num. memory channels: 8 [reseller_asserted_unverified]
per socket memory bandwidth: 204.8GB/S [reseller_asserted_unverified]
expansion options pcie support: GEN4 X128 [reseller_asserted_unverified]

PURCHASE CHECKS
1. Keep the model suffix and ordering code. A CPU model, tray code and OEM upgrade kit can describe different purchasing units.
2. Check the server generation, firmware and thermal support. A matching socket does not by itself prove compatibility.
3. For a multi-socket system, verify pairing requirements and include the correct heatsinks and carriers in the same review.
4. Record whether the offer is production silicon, an engineering sample or a qualification sample. Do not infer its status from the model name.
5. Request top-side markings, package photographs and the stated test scope before accepting a substitution.

PHOTO / EVIDENCE REQUIREMENTS
Top-side markings
Package underside where safe
Carrier or protective tray
Heatsink if included
Production or sample status

Confirm current exact identity, compatibility, stock, price, warranty and delivery terms with sales@aster-rackit.com.